HillTron Corporation, and Industrial Procurement, Manufacturing Sourcing,,

HillTron Corporation

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  • HillTron Corporation offers both lead-free & leaded soldering options on PCB assembly flex circuit assembly rigid flex assembly and wafer substrate assembly. Alloy used for lead-free solder is tin-silver-copper (Sn95/Ag3.5/Cu0.7) with a melting range of 217-220 deg C. We assemble or re-work BGA Micro-BGA CSP QFN SON and similar packages. We have re-worked BGAs with 1400 pins & heat sinks on it.

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